DFI To Showcase Latest Embedded Products and AIoT Solutions at Embedded World, Focusing on Edge AI Opportunities

TAIPEI, March 7, 2023 /PRNewswire/ — DFI, the global leader in embedded motherboards and industrial computers, will showcase its latest products and embedded AI solutions at Embedded World this year Germany. The three highlights of the show include the launch of the AMD Ryzen™ high-performance 1.8-inch industrial motherboard, Intel’s latest processors from the Raptor Lake-S and Alder Lake series, and the industrial motherboard with the high-performance Qualcomm® processor QRB5165.

DFI’s booth at Embedded World will focus on Smart City, Smart Factory, Industrial Pi, Industrial Motherboard and Rugged Products as its main edge computing applications in different fields to demonstrate flexible and customized systems. By leveraging technologies such as Artificial Intelligence of Things (AIoT), Industrial Internet of Things (IIoT) and Internet of Vehicles (IoV), DFI can adequately meet customers’ “new infrastructure” needs.

In terms of Smart Cities, DFI will be showing a range of roadside and vehicle system solutions such as Edge AI Boxes and T-Boxes. Vehicle-to-everything technology (C-V2X) can be effectively used to solve problems of traffic congestion, pedestrian safety and intelligent transportation safety.

Smart factories remain at the heart of global manufacturing development. One of the highlights of this year’s show is workload consolidation, created by advanced virtualization software and hardware technology. As Intel’s first partner with Intel® Virtualization Technology Verification (Graphics SR-IOV), DFI will create a virtualized environment on the show floor while running common industrial automation applications.

In terms of industrial Pi and industrial-grade motherboards, after the release of the GHF51, the world’s first miniature 1.8-inch high-performance motherboard with the AMD Ryzen™ R1000 processor, DFI will launch its new product PCSF51 with the new generation of AMD Ryzen™ launch R2000 processor, not only the CPU and GPU cores are doubled compared to the previous generation, but also the overall performance and computing power have been increased by 50% and 15% respectively.

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Finally, in terms of rugged products, DFI will exemplify superior product design when it comes to features such as shock resistance, waterproofing, dustproofing, and a wide range of temperatures and pressures.

Embedded World 2023 will take place from the 14th of Marchth To March 16thth at the NürnbergMesse in Germany. DFI visitors can register for free with the code “ew23web”. Stand information: Hall 2-631

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Eva Chen [email protected]
Iris Chou [email protected]



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